Μηχανή σύνδεσης IC
(6)
Μηχανή σύνδεσης IC
Τιμή: Negotiable
MOQ: ≥1 pc
Ωρα παράδοσης: 25~50 days
Μάρκα: Suneast
Υψηλό Φως:combined selective multi module wave solder, wave soldering multi module combined selective, combined multi module wave solder selective
IC Bonding Machine The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture. IC bonder is suit able for IC... Δείτε περισσότερα
➤ Επίσκεψη Δικτυακός τόπος
Μηχανή σύνδεσης πολυεπίπεδων IC 0,25*0,25mm-10*10mm Εξοπλισμός σύνδεσης με ψύξη
Τιμή: Negotiable
MOQ: ≥1 pc
Ωρα παράδοσης: 25~50 days
Μάρκα: Suneast
Υψηλό Φως:soldering combined multi module wave selective, selective multi module combined wave soldering, combined wave soldering selective multi module
High Precision Multilayer Capability Quick Changeover IC Bonding Machine WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image p... Δείτε περισσότερα
➤ Επίσκεψη Δικτυακός τόπος
Μηχανή σύνδεσης IC υψηλής ακρίβειας 8-12 ιντσών Wafers Die Bonders
Τιμή: Negotiable
MOQ: ≥1 pc
Ωρα παράδοσης: 25~50 days
Μάρκα: Suneast
Υψηλό Φως:combined wave soldering multi module selective, magnetic spring motor ce iso, iso ce magnetic spring motor
Automatic Nozzle Change High Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic ... Δείτε περισσότερα
➤ Επίσκεψη Δικτυακός τόπος
Γρήγορη αλλαγή IC Die Bonding Machine Supermini Chip Bonding Machine
Τιμή: Negotiable
MOQ: ≥1 pc
Ωρα παράδοσης: 25~50 days
Μάρκα: Suneast
Υψηλό Φως:wave soldering selective combined multi module, multi module combined wave soldering selective, multi module wave soldering selective combined
Supermini Chip Placement Quick Changeover IC Bonder CBD2200 Special use type high precision IC bonder, for a variety of small batch of placement products. It can automatically switch to a variety of bonding heads, and quickly realize the placement of different parameters of a variety of chips. Featu... Δείτε περισσότερα
➤ Επίσκεψη Δικτυακός τόπος
Μηχανή σύνδεσης μικρού αποτυπώματος IC υψηλής ταχύτητας
Τιμή: Negotiable
MOQ: ≥1 pc
Ωρα παράδοσης: 25~50 days
Μάρκα: Suneast
Υψηλό Φως:spring motor ce iso magnetic, motor iso magnetic spring ce, selective wave solder multi module combined
Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design Features: High speed, accurate solidification capacity ±10um@3σ; High production efficiency, low cost input High multi-chip processing capacity, support 16 different types of chip placement High flexibility to suppor... Δείτε περισσότερα
➤ Επίσκεψη Δικτυακός τόπος
Συσσωματωμός Die Bonder SDB 200
Τιμή: Negotiable
MOQ: ≥1 pc
Ωρα παράδοσης: 25~50 days
Μάρκα: Suneast
Υψηλό Φως:selective multi module combined wave solder, wave solder combined selective multi module, selective wave solder combined multi module
Automatic Compact Structure Sintering Die Bonder SDB200 Wafer Loading Introduction: It is designed for power semiconductor IC bonding market, equipped with more powerful BONDHEAD system, which possesses functions like high precision bonding, pressure holding circuit maintaining and heating, achievin... Δείτε περισσότερα
➤ Επίσκεψη Δικτυακός τόπος